PACKAGING SOLUTIONS FOR RF/WIRELESS MICROELECTRONIC SYSTEMS
Monday, January 16, 2006
8:00 AM–5:00 PM
- Telesphor Kamgaing, Intel Corp., Chandler, AZ, USA
- Rashaunda Henderson, Freescale Semiconductor, Tempe, AZ, USA
Thomas Dalrymple, Air Force Research Laboratory
"Drivers and Technologies for Affordable, Lightweight, and Scaleable Electronic Scanned Arrays for Aerospace and Ground Application"
Telesphor Kamgaing, Intel Corporation
"Recent Trends and Technology Developments in RF Packaging Miniaturization"
Andreas Weisshaar , Oregon State University
"Modeling of Silicon-Level RF Passives and Interconnects"
Vikram Jandhyala , University of Washington
"Fast Electromagnetic Simulation Methods and Interfacing to Circuit Simulation for High-Speed and RF Packaging"
Uei-Ming Jow , Industrial Technology Research Institute of Taiwan , ROC
"Wireless LAN (WLAN) Module with Embedded Passives in Printed Wiring Board (PWB)"
Andrew Kay , Skyworks Solutions, Inc.
"Improved Reliability of Hi-Q RF Filters For RF SiP Modules"
Sidharth Dalmia , Jacket Micro Devices, Inc.
"Next Generation Front-End Modules for Multiband Applications Using Liquid Crystalline Polymers"
Miniaturization and functionality increase are main drivers for future wireless communication systems. In order to achieve these challenging goals, significant efforts are needed in the areas of technology development, modeling, characterization and reliability. In particular, the electronic package and/or module must not be a detriment to the circuit it is supporting. In order to minimize packaging losses, accurate characterization and modeling techniques are extremely important. The goal of this workshop is to discuss some recent advances in developing RF packaging solutions for wireless communication systems such as cellular, WLAN, WiFi, WiMax and UWB. Key drivers for civilian and military applications, the development of high performance technology and fast modeling tools for complex structure analysis will be addressed.
From Noon 14 Jan, 2006
17-19 Jan, 2006